General | December 12, 2025
FUJIFILM launches ZEMATES to power next-gen semiconductor packaging
The ZEMATES lineup includes liquid-type polyimide for redistribution layers and protective films
The ZEMATES lineup includes liquid-type polyimide for redistribution layers and protective films
HCLTech will embed Dolphin's specialized low-power IP into its silicon design workflows
Cyient Semiconductors will supply and qualify three foundational process technologies-RF-CMOS, BCD (HV LDMOS), and CMOS Image Sensor (CIS) -for SCL's enhanced 8-inch manufacturing line
The upgrade will double the facility’s production capacity for sputtering targets by 2029
150,000 m2 site to produce critical materials for next generation of AI chips, creating 150 new jobs
Fujifilm’s semiconductor materials business has nearly doubled in sales from FY2021 to FY2024
Sumitomo Chemical will integrate AUECC’s extensive sales and procurement networks, flexible packaging capabilities, and product range to strengthen its global supply chain
BASF’s decision is also supported by close collaboration with a key partner currently building a new chip production facility in Europe
The collaboration paves the way toward leveraging microgravity to advance next-generation chip technologies
Plan is to boost gas purification capacities, build import-linked supply chains, and deploy advanced logistics & packaging solutions
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